Invention Grant
US08173736B2 Addition curable liquid silicone rubber composition for injection molding, method of regulating fluidity of the composition, and method of injection molding silicone rubber composition 有权
用于注射成型的加成可固化液体硅橡胶组合物,调节组合物流动性的方法和注射成型硅橡胶组合物的方法

  • Patent Title: Addition curable liquid silicone rubber composition for injection molding, method of regulating fluidity of the composition, and method of injection molding silicone rubber composition
  • Patent Title (中): 用于注射成型的加成可固化液体硅橡胶组合物,调节组合物流动性的方法和注射成型硅橡胶组合物的方法
  • Application No.: US11558681
    Application Date: 2006-11-10
  • Publication No.: US08173736B2
    Publication Date: 2012-05-08
  • Inventor: Shigeki Shudo
  • Applicant: Shigeki Shudo
  • Applicant Address: JP Tokyo
  • Assignee: Shin-Etsu Chemical Co., Ltd.
  • Current Assignee: Shin-Etsu Chemical Co., Ltd.
  • Current Assignee Address: JP Tokyo
  • Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
  • Priority: JP2005-328100 20051111
  • Main IPC: C08K3/36
  • IPC: C08K3/36
Addition curable liquid silicone rubber composition for injection molding, method of regulating fluidity of the composition, and method of injection molding silicone rubber composition
Abstract:
An addition curable liquid silicone rubber composition for injection molding is provided. The composition comprises (A) an organopolysiloxane containing at least two Si-bonded alkenyl groups within each molecule, (B) an organohydrogenpolysiloxane containing at least two Si-bonded hydrogen atoms within each molecule, (C) a fumed silica with a BET specific surface area of 50 m2/g or greater, and (D) an addition reaction catalyst, and exhibiting fluidity such that, at 23° C., the viscosity at a shear velocity of 0.9 s−1 is not higher than 1,000 Pa·s, and the ratio between the viscosity at a shear velocity of 100 s−1 and the viscosity at a shear velocity of 200 s−1 is not higher than 3.5. The composition is resistant to decreases in viscosity of the rubber material under high shear velocity, and generates no burrs on the molded product.
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