Invention Grant
- Patent Title: Heat-seal resin and package formed therefrom
- Patent Title (中): 热封树脂和由此形成的包装
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Application No.: US12972035Application Date: 2010-12-17
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Publication No.: US08173748B1Publication Date: 2012-05-08
- Inventor: David John Lohse , Thomas Tungshi Sun , Aspy K. Mehta , Gabor Kiss , Robert Patrick Reynolds, Jr. , John W. Chu , Manika Varma-Nair
- Applicant: David John Lohse , Thomas Tungshi Sun , Aspy K. Mehta , Gabor Kiss , Robert Patrick Reynolds, Jr. , John W. Chu , Manika Varma-Nair
- Applicant Address: US NJ Annandale
- Assignee: ExxonMobil Research and Engineering Company
- Current Assignee: ExxonMobil Research and Engineering Company
- Current Assignee Address: US NJ Annandale
- Agent Robert A. Migliorini
- Main IPC: C08F8/00
- IPC: C08F8/00 ; C08L23/00 ; C08L23/04 ; C08L23/10

Abstract:
Provided is a heat-seal resin. The resin includes 5 wt % to 95 wt % of a first copolymer and 95 wt % to 5 wt % of a second copolymer based on the total weight of the resin. The first copolymer and the second copolymer together are 90 wt % or more of the total weight of the resin. The first copolymer includes a first monomer of an alphaolefin of 2 to 4 carbon atoms and a second monomer selected from a second monomer of an alphaolefin of 2 to 8 carbon atoms. The first monomer and the second monomer of the first copolymer are different. The first copolymer has an MFR of from 5 to 1000 g/10 minutes and a Tfm of 66° C. to 80° C. The second copolymer includes a first monomer of an alphaolefin of 2 to 4 carbon atoms and a second monomer selected from a second monomer of an alphaolefin of 2 to 8 carbon atoms. The first monomer and the second monomer of the second copolymer are different. The second copolymer has an MFR of from 0.5 to 5 g/10 minutes and a Tfm of 45° C. to 66° C., wherein the first copolymer has an MFR of at least 2 g/10 minutes greater and a Tfm of at least 10° C. greater than the second copolymer. There is also a package formed partly or entirely of the resin.
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