Invention Grant
US08173909B2 Method for mating flexure to flex-print circuit and flexure therefor
有权
用于将挠曲件与柔性印刷电路配对并弯曲的方法
- Patent Title: Method for mating flexure to flex-print circuit and flexure therefor
- Patent Title (中): 用于将挠曲件与柔性印刷电路配对并弯曲的方法
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Application No.: US11875422Application Date: 2007-10-19
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Publication No.: US08173909B2Publication Date: 2012-05-08
- Inventor: Alex Enriquez Cayaban , Vladimir Aleksic , Shuichi Wakaki
- Applicant: Alex Enriquez Cayaban , Vladimir Aleksic , Shuichi Wakaki
- Applicant Address: JP Osaka
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP Osaka
- Agency: Sughrue Mion, PLLC
- Main IPC: H05K1/11
- IPC: H05K1/11 ; G11B5/48 ; G11B21/16 ; G11B5/60 ; G11B15/64 ; G11B17/32 ; G11B21/20
Abstract:
Inspection windows are cut or formed into the tail section of the flexure circuit tail in a hard disk drive Head Gimbal Assembly (HGA), or CIS, to enable visual inspection of the alignment of the CIS to the head preamp circuit, or FPC. The holes are made in the steel backing and base polyimide, and are positioned between adjacent conductive pads. In addition to facilitating visual inspection, the windows also enable rework of solder. Additionally, solder wicking holes may also be provided in the conductive pads and/or the polyimide and steel backing.
Public/Granted literature
- US20080099236A1 METHOD FOR MATING FLEXURE TO FLEX-PRINT CIRCUIT AND FLEXURE THEREFOR Public/Granted day:2008-05-01
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