A printed circuit board (PCB) ball grid array (BGA) system is provided. In one embodiment, the PCB BGA system includes a PCB, a PCB BGA pad formed on the PCB, a plated through-hole via disposed at least partially through the PCB proximate the PCB BGA pad, and a soldermask disposed over the PCB. The soldermask includes: (i) a BGA pad opening through which the PCB BGA pad is exposed, and (ii) a via opening through which a central portion of the plated through-hole via is exposed. The via opening has an inner diameter that is less than the outer diameter of the plated through-hole via.