Invention Grant
- Patent Title: Method and apparatus for forming hole
- Patent Title (中): 孔形成方法及装置
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Application No.: US12198506Application Date: 2008-08-26
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Publication No.: US08173933B2Publication Date: 2012-05-08
- Inventor: Kengo Takeshita , Takashi Hoshiyama
- Applicant: Kengo Takeshita , Takashi Hoshiyama
- Applicant Address: JP Kariya
- Assignee: DENSO CORPORATION
- Current Assignee: DENSO CORPORATION
- Current Assignee Address: JP Kariya
- Agency: Nixon & Vanderhye PC
- Priority: JP2007-221124 20070828
- Main IPC: B23K26/00
- IPC: B23K26/00 ; B26D1/00

Abstract:
In a method of forming a hole on a work piece, a laser beam is directed from a laser head to a predetermined portion of the work piece to form a pilot hole having a first surface condition, and then the predetermined portion of the work piece is punched using a die and a punch having a cross-section greater than a cross-section of the pilot hole. Thus, a finished hole having a cross-section greater than the cross-section of the pilot hole is formed over the pilot hole. The finished hole has a second surface condition, and the second surface condition is formed by transforming the first surface condition by the punch to have a precise dimension.
Public/Granted literature
- US20090057281A1 METHOD AND APPARATUS FOR FORMING HOLE Public/Granted day:2009-03-05
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