Invention Grant
- Patent Title: Pattern displacement measuring method and pattern measuring device
- Patent Title (中): 图案位移测量方法和图案测量装置
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Application No.: US12708148Application Date: 2010-02-18
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Publication No.: US08173962B2Publication Date: 2012-05-08
- Inventor: Takumichi Sutani , Ryoichi Matsuoka , Hidetoshi Morokuma , Akiyuki Sugiyama , Hiroyuki Shindo
- Applicant: Takumichi Sutani , Ryoichi Matsuoka , Hidetoshi Morokuma , Akiyuki Sugiyama , Hiroyuki Shindo
- Applicant Address: JP Tokyo
- Assignee: Hitachi High-Technologies Corporation
- Current Assignee: Hitachi High-Technologies Corporation
- Current Assignee Address: JP Tokyo
- Agency: McDermott Will & Emery LLP
- Priority: JP2006-235876 20060831
- Main IPC: A61N5/00
- IPC: A61N5/00 ; G06K9/00 ; G01C25/00 ; G01R31/00

Abstract:
An evaluation method and apparatus is provided for evaluating a displacement between patterns of a pattern image by using design data representative of a plurality of patterns superimposed ideally. A first distance is measured for an upper layer pattern between a line segment of the design data and an edge of the charged particle radiation image, a second distance is measured for a lower layer pattern between a line segment of the design data and an edge of the charged particle radiation image; and an superimposition displacement is detected between the upper layer pattern and lower layer pattern in accordance with the first distance and second distance.
Public/Granted literature
- US20100140472A1 PATTERN DISPLACEMENT MEASURING METHOD AND PATTERN MEASURING DEVICE Public/Granted day:2010-06-10
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