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US08173987B2 Integrated circuit 3D phase change memory array and manufacturing method 有权
集成电路3D相变存储器阵列及制造方法

Integrated circuit 3D phase change memory array and manufacturing method
Abstract:
A 3D phase change memory device is based on an array of electrode pillars and a plurality of electrode planes that intersect the electrode pillars at interface regions that include memory elements that comprise a programmable phase change memory element and a threshold switching element. The electrode pillars can be selected using two-dimensional decoding, and the plurality of electrode planes can be selected using decoding on a third dimension.
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