Invention Grant
US08174028B2 Semiconductor composite apparatus, LED, LED printhead, and image forming apparatus
有权
半导体复合设备，LED，LED打印头和成像设备
- Patent Title: Semiconductor composite apparatus, LED, LED printhead, and image forming apparatus
- Patent Title (中): 半导体复合设备，LED，LED打印头和成像设备
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Application No.: US12902172Application Date: 2010-10-12
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Publication No.: US08174028B2Publication Date: 2012-05-08
- Inventor: Mitsuhiko Ogihara , Masataka Muto , Tomoki Igari , Takahito Suzuki
- Applicant: Mitsuhiko Ogihara , Masataka Muto , Tomoki Igari , Takahito Suzuki
- Applicant Address: JP Tokyo
- Assignee: Oki Data Corporation
- Current Assignee: Oki Data Corporation
- Current Assignee Address: JP Tokyo
- Agency: Panitch Schwarze Belisario & Nadel LLP
- Priority: JP2005-057636 20050302
- Main IPC: H01L27/15
- IPC: H01L27/15
Abstract:
A semiconductor composite apparatus includes a substrate and a planarizing layer, and a semiconductor thin film. The planarizing layer is formed on the substrate either directly or indirectly. The planarizing layer includes a first surface that faces the substrate, and a second surface that is on the side of the planarizing layer remote from the substrate. The semiconductor thin film formed on the planarizing layer. The second surface has a roughness of not more than 5 nm.
Public/Granted literature
- US20110024788A1 SEMICONDUCTOR COMPOSITE APPARATUS, LED, LED PRINTHEAD, AND IMAGE FORMING APPARATUS Public/Granted day:2011-02-03
Information query
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