Invention Grant
US08174030B2 Luminous devices, packages and systems containing the same, and fabricating methods thereof 有权
发光装置,包装及其制造方法及其制造方法

Luminous devices, packages and systems containing the same, and fabricating methods thereof
Abstract:
The present invention is directed to a vertical-type luminous device and high through-put methods of manufacturing the luminous device. These luminous devices can be utilized in a variety of luminous packages, which can be placed in luminous systems. The luminous devices are designed to maximize light emitting efficiency and/or thermal dissipation. Other improvements include an embedded zener diode to protect against harmful reverse bias voltages.
Information query
Patent Agency Ranking
0/0