Invention Grant
- Patent Title: Light-emitting element chip, exposure device and image forming apparatus
- Patent Title (中): 发光元件芯片,曝光装置和成像装置
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Application No.: US12364668Application Date: 2009-02-03
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Publication No.: US08174031B2Publication Date: 2012-05-08
- Inventor: Yoshinao Kondoh
- Applicant: Yoshinao Kondoh
- Applicant Address: JP Tokyo
- Assignee: Fuji Xerox Co., Ltd.
- Current Assignee: Fuji Xerox Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Fildes & Outland, P.C.
- Priority: JP2008-208785 20080813
- Main IPC: H01L27/15
- IPC: H01L27/15

Abstract:
The light-emitting element chip includes: a substrate; a light-emitting portion including plural light-emitting elements each having a first semiconductor layer that has a first conductivity type and that is stacked on the substrate, a second semiconductor layer that has a second conductivity type and that is stacked on the first semiconductor layer, the second conductivity type being a conductivity type different from the first conductivity type, a third semiconductor layer that has the first conductivity type and that is stacked on the second semiconductor layer, and a fourth semiconductor layer that has the second conductivity type and that is stacked on the third semiconductor layer; and a controller including a logical operation element that performs logical operation for causing the plural light-emitting elements to perform a light-emitting operation, the logical operation element being formed by combining some sequential layers of the first, second, third and fourth semiconductor layers.
Public/Granted literature
- US08124987B2 Light-emitting element chip, exposure device and image forming apparatus Public/Granted day:2012-02-28
Information query
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