Invention Grant
- Patent Title: Light emission device including semiconductor light emitting elements
- Patent Title (中): 发光装置,包括半导体发光元件
-
Application No.: US12105058Application Date: 2008-04-17
-
Publication No.: US08174033B2Publication Date: 2012-05-08
- Inventor: Akinori Yoneda , Akiyoshi Kinouchi , Hirofumi Kawaguchi
- Applicant: Akinori Yoneda , Akiyoshi Kinouchi , Hirofumi Kawaguchi
- Applicant Address: JP Tokushima
- Assignee: Nichia Corporation
- Current Assignee: Nichia Corporation
- Current Assignee Address: JP Tokushima
- Agency: Ditthavong Mori & Steiner, P.C.
- Priority: JP2007-108827 20070418; JP2008-26481 20080206
- Main IPC: H01L33/00
- IPC: H01L33/00

Abstract:
A light emission device includes a plurality of semiconductor light emitting elements and a supporting substrate on which the plurality of semiconductor light emitting elements are flip-chip mounted. Each of the plurality of semiconductor light emitting elements has a substantially rectangular shape which has a first side and a second side different from the first side. Light emitted from a first element end face on the first side is stronger than light emitted from a second element end face on the second side. Each first side of each of the plurality of semiconductor light emitting elements faces each other substantially in parallel.
Public/Granted literature
- US20080258158A1 LIGHT EMISSION DEVICE Public/Granted day:2008-10-23
Information query
IPC分类: