Invention Grant
- Patent Title: Semiconductor device and method of fabricating the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US12628283Application Date: 2009-12-01
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Publication No.: US08174049B2Publication Date: 2012-05-08
- Inventor: Masakazu Goto
- Applicant: Masakazu Goto
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Turocy & Watson, LLP
- Priority: JP2009-3560 20090109
- Main IPC: H01L29/66
- IPC: H01L29/66

Abstract:
A semiconductor device according to one embodiment includes: a semiconductor substrate having first and second regions; a first transistor comprising a first gate insulating film and a first gate electrode thereon in the first region on the semiconductor substrate, the first gate insulating film comprising a first interface layer containing nitrogen atoms and a first high dielectric constant layer thereon; a second transistor comprising a second gate insulating film and a second gate electrode thereon in the second region on the semiconductor substrate, the second gate insulating film comprising a second interface layer and a second high dielectric constant layer thereon, the second interface layer containing nitrogen atoms at an average concentration lower than that of the first interface layer or not containing nitrogen atoms, and the second transistor having a threshold voltage different from that of the first transistor; and an element isolation region on the semiconductor substrate, the element isolation region containing oxygen atoms and isolating the first transistor from the second transistor.
Public/Granted literature
- US20100176460A1 SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME Public/Granted day:2010-07-15
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