Invention Grant
- Patent Title: Integrated circuit structures with multiple FinFETs
- Patent Title (中): 具有多个FinFET的集成电路结构
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Application No.: US11807652Application Date: 2007-05-30
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Publication No.: US08174073B2Publication Date: 2012-05-08
- Inventor: Tsung-Lin Lee , Chang-Yun Chang , Sheng-Da Liu , Fu-Liang Yang
- Applicant: Tsung-Lin Lee , Chang-Yun Chang , Sheng-Da Liu , Fu-Liang Yang
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L27/12
- IPC: H01L27/12

Abstract:
A semiconductor structure includes a semiconductor substrate; and a first Fin field-effect transistor (FinFET) and a second FinFET at a surface of the semiconductor substrate. The first FinFET includes a first fin; and a first gate electrode over a top surface and sidewalls of the first fin. The second FinFET includes a second fin spaced apart from the first fin by a fin space; and a second gate electrode over a top surface and sidewalls of the second fin. The second gate electrode is electrically disconnected from the first gate electrode. The first and the second gate electrodes have a gate height greater than about one half of the fin space.
Public/Granted literature
- US20080296702A1 Integrated circuit structures with multiple FinFETs Public/Granted day:2008-12-04
Information query
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