Invention Grant
- Patent Title: Semiconductor device having at least two terminals among the plurality of terminals electrically connected to each other while not being adjacent to one other and not being connected to internal circuit
- Patent Title (中): 所述多个端子中具有至少两个端子的半导体器件彼此电连接而不彼此相邻并且不连接到内部电路
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Application No.: US12203199Application Date: 2008-09-03
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Publication No.: US08174110B2Publication Date: 2012-05-08
- Inventor: Hideo Imai
- Applicant: Hideo Imai
- Applicant Address: JP
- Assignee: Epson Imaging Devices Corporation
- Current Assignee: Epson Imaging Devices Corporation
- Current Assignee Address: JP
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP2007-228599 20070904; JP2008-181432 20080711
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
A semiconductor device includes a base substrate including an internal circuit, a resin protrusion part that is disposed to protrude on an active face side of the base substrate, and a plurality of terminals that are formed by including an island-shaped conductive film disposed on the resin protrusion part. The plurality of terminals includes a terminal that a conductive state with the internal circuit, and a wiring line that electrically connects at least two terminals among the plurality of terminals is disposed on the active face side.
Public/Granted literature
- US20090057924A1 SEMICONDUCTOR DEVICE, SEMICONDUCTOR MOUNTING STRUCTURE, AND ELECTRO-OPTICAL DEVICE Public/Granted day:2009-03-05
Information query
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