Invention Grant
- Patent Title: Methods of fabricating robust integrated heat spreader designs and structures formed thereby
- Patent Title (中): 制造强大的集成散热器设计和结构的方法
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Application No.: US12284097Application Date: 2008-09-17
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Publication No.: US08174113B2Publication Date: 2012-05-08
- Inventor: Abhishek Gupta , Mike Boyd , Carl Deppisch , Jinlin Wang , Daewoong Suh , Brad Drew
- Applicant: Abhishek Gupta , Mike Boyd , Carl Deppisch , Jinlin Wang , Daewoong Suh , Brad Drew
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agent Kathy J. Ortiz
- Main IPC: H01L23/10
- IPC: H01L23/10 ; H01L23/34
Abstract:
Methods and associated structures of forming an indium containing solder material directly on an active region of a copper IHS is enabled. A copper indium containing solder intermetallic is formed on the active region of the IHS. The solder intermetallic improves the solder-TIM integration process for microelectronic packaging applications.
Public/Granted literature
- US20100065246A1 Methods of fabricating robust integrated heat spreader designs and structures formed thereby Public/Granted day:2010-03-18
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