A semiconductor integrated circuit according to an exemplary embodiment of the present invention includes an I/O buffer provided in a semiconductor chip, single-layer pads, and multilayer pads. The single-layer pads are formed above the I/O buffer. The multilayer pads are formed above the I/O buffer separately from the single-layer pads. The single-layer pads are pads dedicated to bonding, and the multilayer pads are pads on which both probing and bonding are performed.