Invention Grant
- Patent Title: Laser dicing sheet and manufacturing method for chip body
- Patent Title (中): 激光切割片及其制造方法
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Application No.: US11949163Application Date: 2007-12-03
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Publication No.: US08174130B2Publication Date: 2012-05-08
- Inventor: Yosuke Sato , Yoji Wakayama , Naoki Taya
- Applicant: Yosuke Sato , Yoji Wakayama , Naoki Taya
- Applicant Address: JP Tokyo
- Assignee: Lintec Corporation
- Current Assignee: Lintec Corporation
- Current Assignee Address: JP Tokyo
- Agency: Hahn & Voight PLLC
- Agent Roger C. Hahn
- Priority: JP2006-328612 20061205
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40 ; B23K26/00
Abstract:
Disclosed herein is a laser dicing sheet comprising a base material comprising a polyurethane acrylate film and a shape-restoring film; and an adhesive layer formed on a surface of said polyurethane acrylate film of the base material.
Public/Granted literature
- US20080132034A1 LASER DICING SHEET AND MANUFACTURING METHOD FOR CHIP BODY Public/Granted day:2008-06-05
Information query
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