Invention Grant
US08174279B2 Socket connector for connection lead of semiconductor device under test with tester
有权
用于测试的半导体器件连接引线的插座连接器
- Patent Title: Socket connector for connection lead of semiconductor device under test with tester
- Patent Title (中): 用于测试的半导体器件连接引线的插座连接器
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Application No.: US12545074Application Date: 2009-08-21
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Publication No.: US08174279B2Publication Date: 2012-05-08
- Inventor: Kok Hua Lee , Zi Yi Lam , Wai Khuin Phoon
- Applicant: Kok Hua Lee , Zi Yi Lam , Wai Khuin Phoon
- Applicant Address: US TX Austin
- Assignee: Freescale Semiconductor, Inc.
- Current Assignee: Freescale Semiconductor, Inc.
- Current Assignee Address: US TX Austin
- Agent Charles Bergere
- Main IPC: G01R31/00
- IPC: G01R31/00 ; G01R31/20 ; G01R1/067

Abstract:
A socket connector for electrically connecting a lead of a semiconductor device under test (DUT) with a tester includes a container having a chamber, a conductive end or plug that seals the chamber at one end, and a conductive membrane that seals the chamber at another end. A liquid conductive material fills the chamber. The conductive plug is arranged to be in electrical contact with the tester. The lead of the semiconductor DUT is in electrical contact with the conductive membrane and thus with the tester via the conductive membrane, the liquid conductive material and the conductive plug.
Public/Granted literature
- US20110043234A1 SOCKET CONNECTOR FOR CONNECTION LEAD OF SEMICONDUCTOR DEVICE UNDER TEST WITH TESTER Public/Granted day:2011-02-24
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