Invention Grant
- Patent Title: Thermal assembly coupled with an appliance
- Patent Title (中): 热组件与设备相结合
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Application No.: US12121836Application Date: 2008-05-16
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Publication No.: US08174351B2Publication Date: 2012-05-08
- Inventor: Joseph J. Scheiber , Michael S. Coverstone , Jeremiah Lewis
- Applicant: Joseph J. Scheiber , Michael S. Coverstone , Jeremiah Lewis
- Applicant Address: US IN Kendallville
- Assignee: Group Dekko, Inc.
- Current Assignee: Group Dekko, Inc.
- Current Assignee Address: US IN Kendallville
- Agency: Taylor IP, P.C.
- Main IPC: H01H85/20
- IPC: H01H85/20 ; H01H85/02
Abstract:
An appliance assembly includes an appliance and an appliance member. The appliance includes a wall defining a plurality of holes. The appliance member is carried by the appliance. The appliance member includes a housing which includes a snap-fit arrangement coupled with the appliance. The snap-fit arrangement includes a first plurality of ears and a second plurality of ears, the first and second plurality of ears snap-fittingly engaging the plurality of holes.
Public/Granted literature
- US20080285253A1 THERMAL ASSEMBLY COUPLED WITH AN APPLIANCE Public/Granted day:2008-11-20
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