Invention Grant
US08174596B2 Wafer-scale linear image sensor chip and method with replicated gapless pixel line and signal readout circuit segments
有权
晶圆尺度线性图像传感器芯片和方法,具有复制无间隙像素线和信号读出电路段
- Patent Title: Wafer-scale linear image sensor chip and method with replicated gapless pixel line and signal readout circuit segments
- Patent Title (中): 晶圆尺度线性图像传感器芯片和方法,具有复制无间隙像素线和信号读出电路段
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Application No.: US12506254Application Date: 2009-07-21
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Publication No.: US08174596B2Publication Date: 2012-05-08
- Inventor: Weng-Lyang Wang , Shengmin Lin , Chi-Pin Lin , Feng-Ke Hsiao
- Applicant: Weng-Lyang Wang , Shengmin Lin , Chi-Pin Lin , Feng-Ke Hsiao
- Applicant Address: US CA Cupertino
- Assignee: CMOS Sensor Inc.
- Current Assignee: CMOS Sensor Inc.
- Current Assignee Address: US CA Cupertino
- Agency: CH Emily LLC
- Agent Chein-Hwa Tsao
- Main IPC: H04N3/14
- IPC: H04N3/14

Abstract:
A wafer-scale linear image sensor chip (WLISC) is proposed with gapless pixel line and signal readout circuit segments. The WLISC converts pixel line image (PLI) of length LPL into line image signal (LIS). The WLISC includes a linear array of sensor segments. Each sensor segment includes a gapless local pixel line segment (LPLSj) of sensing elements. The LPLSj converts portion of the PLI into a raw image segment signal set (RISSj). The LPLSj set forms a gapless global pixel line (GPL) corresponding to PLI. The sensor segment also includes readout circuit segment (RCSj) coupled to LPLSj for processing RISSj into a readout image segment signal set (ROSSj). The RCSj has a set of contact pads (CTPj) for off-chip interconnection. Upon off-chip interconnection of the CTPj set thus composing the ROSSj set into LIS, the WLISC functions as a key part of a linear image sensor system of image length LPL.
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