A solid-state imaging device includes: a pixel portion configured to convert light into an electric signal; a substrate where the pixel portion is formed; an optical communication unit configured to convert a signal read out from the pixel portion into an optical signal, and outputs the optical signal, which is disposed in one surface where the pixel portion is formed of the substrate; and a light shielding portion configured to shield, of signal light to be output from the optical communication unit, light that directs to the pixel portion, and light to be leaked from the optical communication unit, which is disposed around the optical communication unit.