Invention Grant
- Patent Title: Substrate mounting structure for a camera device
- Patent Title (中): 相机装置的基板安装结构
-
Application No.: US12468481Application Date: 2009-05-19
-
Publication No.: US08174613B2Publication Date: 2012-05-08
- Inventor: Akihiro Nakamura
- Applicant: Akihiro Nakamura
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2008-143274 20080530
- Main IPC: H04N5/225
- IPC: H04N5/225

Abstract:
The present invention provides a camera device including: an image pickup element; a substrate mounted with the image pickup element thereon; and a housing accommodating the image pickup element therein. The housing is provided with a plurality of support members which extend upright and to which an external edge portion of the substrate is stuck with an adhesive. The substrate is provided with an application area to which the adhesive is applied, at the external edge portion stuck with the support members.
Public/Granted literature
- US20090295985A1 CAMERA DEVICE Public/Granted day:2009-12-03
Information query