Invention Grant
US08174844B2 Wired circuit board and connection structure between wired circuit boards
有权
有线电路板和有线电路板之间的连接结构
- Patent Title: Wired circuit board and connection structure between wired circuit boards
- Patent Title (中): 有线电路板和有线电路板之间的连接结构
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Application No.: US12654034Application Date: 2009-12-08
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Publication No.: US08174844B2Publication Date: 2012-05-08
- Inventor: Hitoki Kanagawa , Akinori Itokawa , Naotaka Higuchi
- Applicant: Hitoki Kanagawa , Akinori Itokawa , Naotaka Higuchi
- Applicant Address: JP Osaka
- Assignee: NITTO DENKO Corporation
- Current Assignee: NITTO DENKO Corporation
- Current Assignee Address: JP Osaka
- Agency: Edwards Neils PLLC
- Agent Jean C. Edwards, Esq.
- Priority: JP2008-322566 20081218
- Main IPC: H05K1/11
- IPC: H05K1/11
Abstract:
A wired circuit board for electrically connecting a suspension board with circuit comprising a metal supporting layer, an insulating base layer, a conductive layer, and an insulating cover layer, and an external circuit, includes a first wired circuit board electrically connected with the suspension board with circuit; and a second wired circuit board for electrically connecting with the external circuit. The first wired circuit board and the second wired circuit board are electrically connected through a preamplifier. The first wired circuit board includes a first metal supporting layer; a first insulating base layer; a first conductive layer and a first insulating cover layer.
Public/Granted literature
- US20100157560A1 Wired circuit board and connection structure between wired circuit boards Public/Granted day:2010-06-24
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