Invention Grant
- Patent Title: Shield case and circuit board assembly
- Patent Title (中): 屏蔽盒和电路板组装
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Application No.: US12389663Application Date: 2009-02-20
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Publication No.: US08174847B2Publication Date: 2012-05-08
- Inventor: Takahisa Ohtsuji , Takayuki Nagata
- Applicant: Takahisa Ohtsuji , Takayuki Nagata
- Applicant Address: JP Yao-Shi
- Assignee: Hosiden Corporation
- Current Assignee: Hosiden Corporation
- Current Assignee Address: JP Yao-Shi
- Agency: Kratz, Quintos & Hanson, LLP
- Priority: JP2008-103426 20080411
- Main IPC: H05K7/14
- IPC: H05K7/14
Abstract:
A shield case of the present invention include a first case; and a second case, combinable with the first case. The first and second cases are provided with a plurality of abutting parts. The abutting parts abut on all respective surfaces of the component mounting board and hold the component mounting board in suspension in a state where the first and second cases are combined.
Public/Granted literature
- US20090257213A1 SHIELD CASE AND CIRCUIT BOARD ASSEMBLY Public/Granted day:2009-10-15
Information query
