Invention Grant
- Patent Title: Communication devices with integrated thermal sensing circuit and methods for use therewith
- Patent Title (中): 具有集成热感测电路的通信设备及其使用方法
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Application No.: US11804522Application Date: 2007-05-17
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Publication No.: US08175545B2Publication Date: 2012-05-08
- Inventor: Ahmadreza Reza Rofougaran
- Applicant: Ahmadreza Reza Rofougaran
- Applicant Address: US CA Irvine
- Assignee: Broadcom Corporation
- Current Assignee: Broadcom Corporation
- Current Assignee Address: US CA Irvine
- Agency: Garlick & Markison
- Agent Bruce E. Stuckman
- Main IPC: H04B1/40
- IPC: H04B1/40
Abstract:
A communication device includes an integrated circuit having an on-chip thermal sensing circuit that generates a temperature signal based on a temperature of the integrated circuit. A processing module processes the temperature signal to generate temperature information that can be transmitted to a remote device or processes the temperature signal to generate control for adjusting transmit and/or receive characteristics of an RF transceiver.
Public/Granted literature
- US20080285633A1 Communication devices with integrated thermal sensing circuit and methods for use therewith Public/Granted day:2008-11-20
Information query
