Invention Grant
- Patent Title: Method of estimating support state of an electronic apparatus housing and electronic apparatus
- Patent Title (中): 估计电子设备外壳和电子设备的支撑状态的方法
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Application No.: US12962138Application Date: 2010-12-07
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Publication No.: US08175837B2Publication Date: 2012-05-08
- Inventor: Minoru Mukai , Takahiro Omori , Daisuke Yamamoto
- Applicant: Minoru Mukai , Takahiro Omori , Daisuke Yamamoto
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Ohlandt, Greeley, Ruggiero & Perle, L.L.P.
- Priority: JP2007-220281 20070827
- Main IPC: G06F19/00
- IPC: G06F19/00

Abstract:
In a method of estimating one of mechanical supporting states of a housing for an electronic apparatus, a drive signal is supplied to an oscillation device from which first oscillation is applied to the housing. A sensor detects a second oscillation transferred through the housing in response to the first oscillation to generate an oscillation signal, and a measurement response characteristic is obtained based on the drive signal and the oscillation signal, and is compared with reference response characteristics which are correlated with the mechanical supporting states, respectively, to estimate one of the mechanical supporting states of the housing.
Public/Granted literature
- US20110072902A1 METHOD OF ESTIMATING SUPPORT STATE OF AN ELECTRONIC APPARATUS HOUSING AND ELECTRONIC APPARATUS Public/Granted day:2011-03-31
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