Invention Grant
US08177319B2 Liquid jetting apparatus, liquid delivery system, and circuit board
有权
液体喷射装置,液体输送系统和电路板
- Patent Title: Liquid jetting apparatus, liquid delivery system, and circuit board
- Patent Title (中): 液体喷射装置,液体输送系统和电路板
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Application No.: US12424375Application Date: 2009-04-15
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Publication No.: US08177319B2Publication Date: 2012-05-15
- Inventor: Yuichi Nishihara
- Applicant: Yuichi Nishihara
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Stroock & Stroock & Lavan LLP
- Priority: JP2008-108073 20080417; JP2009-94710 20090409
- Main IPC: B41J2/175
- IPC: B41J2/175 ; B41J2/195 ; B41J29/393

Abstract:
A liquid jetting apparatus receives delivery of liquid from a liquid delivery system including a delivery system-side terminal. The liquid jetting apparatus includes a apparatus-side terminal, a contact sensing portion and a remaining level sensor portion. The apparatus-side terminal contacts the delivery system-side terminal when receiving delivery of liquid from the liquid delivery system. The contact sensing portion supplies a first electrical signal to the apparatus-side terminal to sense contact between the apparatus-side terminal and the system-side terminal. The remaining level sensor portion supplies a second electrical signal different from the first electrical signal to the apparatus-side terminal to sense a liquid volume in the liquid delivery system.
Public/Granted literature
- US20090262161A1 Liquid Jetting Apparatus, Liquid Delivery System, and Circuit Board Public/Granted day:2009-10-22
Information query
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