Invention Grant
- Patent Title: Transducer interconnect with conductive films
- Patent Title (中): 传感器与导电膜互连
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Application No.: US12258126Application Date: 2008-10-24
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Publication No.: US08177335B2Publication Date: 2012-05-15
- Inventor: Bradley James Gerner , John R. Andrews , Pinyen Lin
- Applicant: Bradley James Gerner , John R. Andrews , Pinyen Lin
- Applicant Address: US CT Norwalk
- Assignee: Xerox Corporation
- Current Assignee: Xerox Corporation
- Current Assignee Address: US CT Norwalk
- Agency: Marger Johnson & McCollom PC
- Main IPC: B41J2/045
- IPC: B41J2/045 ; B41J2/14 ; B41J2/16

Abstract:
An electronic device has an electronic signal source electrically connected to a signal routing circuit, an electrically activated transducer to receive electronic signals through the signal routing circuit, and an anisotropic conductive film to provide electrical continuity between the signal routing circuit and the transducer, the anisotropic conductive film having material removed adjacent the transducer to reduce mechanical loading of the transducer. A print head has a jet stack including an aperture plate having apertures arranged to allow passage of ink stored in the jet stack, a diaphragm arranged adjacent the jet stack so as to apply pressure on the ink stored in the jet stack, a transducer arranged to cause the diaphragm to deflect when activated, an anisotropic conductive film having material removed adjacent the transducer to reduce mechanical loading of the transducer, and an electrical interconnect formed from the anisotropic conductive film arranged to electrically couple the transducer to a signal routing circuit. A method includes patterning an anisotropic conductive film to form an array of openings or recesses, bonding the patterned anisotropic conductive film to a transducer side of a transducer array such that openings or recesses in the anisotropic conducting film are arranged adjacent each transducer so as to not contact the transducer in the region of maximum deflection, and bonding a signal carrying circuit array to a circuit side of the transducer array using the patterned anisotropic conductive film.
Public/Granted literature
- US20100103224A1 TRANSDUCER INTERCONNECT WITH CONDUCTIVE FILMS Public/Granted day:2010-04-29
Information query
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