Invention Grant
- Patent Title: Socket contact terminal and semiconductor device
- Patent Title (中): 插座接触端子和半导体器件
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Application No.: US12302867Application Date: 2007-05-23
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Publication No.: US08177561B2Publication Date: 2012-05-15
- Inventor: Yasuhiro Ouchi , Shinichi Nikaido , Haruo Miyazawa , Hirohito Watanabe , Katsuya Yamagami
- Applicant: Yasuhiro Ouchi , Shinichi Nikaido , Haruo Miyazawa , Hirohito Watanabe , Katsuya Yamagami
- Applicant Address: JP Tokyo
- Assignee: Fujikura Ltd.
- Current Assignee: Fujikura Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2006-149510 20060530; JP2006-154545 20060602; JP2006-158670 20060607; JP2006-162508 20060612; JP2006-162509 20060612
- International Application: PCT/JP2007/060513 WO 20070523
- International Announcement: WO2007/138952 WO 20071206
- Main IPC: H05K1/00
- IPC: H05K1/00

Abstract:
A socket contact terminal for electrical connection between a connection portion formed of a metal conductor on a printed circuit board and a connection terminal of an IC package. The contact terminal comprises a metal terminal composed of a main columnar portion and arm portions on both sides and having an angular U shape and an elastomeric member attached to the metal terminal. A metal surface is exposed from the outer surface of each arm portion. The elastomeric member is firmly held between the arm portions of the metal terminal and exhibits a repulsive force when the arm portions are pressed in the direction that the arm portions approach each other.
Public/Granted literature
- US20090250256A1 SOCKET CONTACT TERMINAL AND SEMICONDUCTOR DEVICE Public/Granted day:2009-10-08
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