Invention Grant
- Patent Title: Electronic system with expansion feature
- Patent Title (中): 电子系统具有扩展功能
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Application No.: US11750715Application Date: 2007-05-18
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Publication No.: US08178392B2Publication Date: 2012-05-15
- Inventor: Haengcheol Choi , Ki Youn Jang , Taewoo Kang , Il Kwon Shim
- Applicant: Haengcheol Choi , Ki Youn Jang , Taewoo Kang , Il Kwon Shim
- Applicant Address: SG Singapore
- Assignee: Stats Chippac Ltd.
- Current Assignee: Stats Chippac Ltd.
- Current Assignee Address: SG Singapore
- Agency: Ishimaru & Associates LLP
- Agent Mikio Ishimaru; Stanley Chang
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L23/48 ; H01L23/52 ; H01L29/40
Abstract:
An electronic system is provided including forming a substrate having a radiating patterned pad, mounting an electrical device having an external interconnect over the radiating patterned pad with the external interconnect offset from the radiating patterned pad, and aligning the external interconnect with the radiating patterned pad.
Public/Granted literature
- US20080283998A1 ELECTRONIC SYSTEM WITH EXPANSION FEATURE Public/Granted day:2008-11-20
Information query
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