Invention Grant
US08178411B2 Method for producing a stop zone in a semiconductor body and semiconductor component having a stop zone
有权
用于在半导体本体中制造阻挡区域的方法和具有停止区域的半导体部件
- Patent Title: Method for producing a stop zone in a semiconductor body and semiconductor component having a stop zone
- Patent Title (中): 用于在半导体本体中制造阻挡区域的方法和具有停止区域的半导体部件
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Application No.: US12550483Application Date: 2009-08-31
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Publication No.: US08178411B2Publication Date: 2012-05-15
- Inventor: Reiner Barthelmess , Anton Mauder , Franz Josef Niedernostheide , Hans-Joachim Schulze
- Applicant: Reiner Barthelmess , Anton Mauder , Franz Josef Niedernostheide , Hans-Joachim Schulze
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Priority: DE102005026408 20050608
- Main IPC: H01L21/336
- IPC: H01L21/336 ; H01L21/425

Abstract:
A method for producing a buried stop zone in a semiconductor body and a semiconductor component having a stop zone, the method including providing a semiconductor body having a first and a second side and a basic doping of a first conduction type. The method further includes irradiating the semiconductor body via one of the sides with protons, as a result of which protons are introduced into a first region of the semiconductor body situated at a distance from the irradiation side. The method also includes carrying out a thermal process in which the semiconductor body is heated to a predetermined temperature for a predetermined time duration, the temperature and the duration being chosen such that hydrogen-induced donors are generated both in the first region and in a second region adjacent to the first region in the direction of the irradiation side.
Public/Granted literature
- US20100015818A1 Method for Producing a Stop Zone in a Semiconductor Body and Semiconductor Component Having a Stop Zone Public/Granted day:2010-01-21
Information query
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