Invention Grant
- Patent Title: Semiconductor device and method for fabricating the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US12643741Application Date: 2009-12-21
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Publication No.: US08178432B2Publication Date: 2012-05-15
- Inventor: Yong Keon Choi
- Applicant: Yong Keon Choi
- Applicant Address: KR Seoul
- Assignee: Dongbu HiTek Co., Ltd.
- Current Assignee: Dongbu HiTek Co., Ltd.
- Current Assignee Address: KR Seoul
- Agency: The Law Offices of Andrew D. Fortney
- Agent Andrew D. Fortney
- Priority: KR10-2008-0138334 20081231
- Main IPC: H01J21/22
- IPC: H01J21/22 ; H01J29/66

Abstract:
Semiconductor devices and methods for fabricating the same are disclosed. The semiconductor device includes gate electrodes having sidewall spacers on a semiconductor substrate, double diffusion drain regions in the semiconductor substrate adjacent to the sidewall spacers, double diffusion junction regions aligned with the gate electrodes, and source/drain regions in the double diffusion junction regions.
Public/Granted literature
- US20100163983A1 Semiconductor Device and Method for Fabricating the Same Public/Granted day:2010-07-01
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