Invention Grant
- Patent Title: Sealant-filled enclosures and methods for environmentally protecting a connection
- Patent Title (中): 密封剂填充的外壳和环境保护连接的方法
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Application No.: US12619928Application Date: 2009-11-17
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Publication No.: US08178783B2Publication Date: 2012-05-15
- Inventor: Harry George Yaworski , Jimmy E. Marks , Mahmoud K. Seraj
- Applicant: Harry George Yaworski , Jimmy E. Marks , Mahmoud K. Seraj
- Applicant Address: US PA Berwyn
- Assignee: Tyco Electronics Corporation
- Current Assignee: Tyco Electronics Corporation
- Current Assignee Address: US PA Berwyn
- Agency: Myers Bigel Sibley & Sajovec, PA
- Main IPC: H02G15/113
- IPC: H02G15/113

Abstract:
A sealant-filled enclosure for environmentally sealing a connection includes a first cover member and a second cover member. The first cover member defines a first cavity having a first bottom. The second cover member is pivotally connected to the first cover member for movement between an open position and a closed position. The second cover member defines a second cavity having a second bottom. A first sealant is positioned in the first cavity and extends up to a first level relative to the first bottom without a connection disposed in the first cavity. A second sealant is positioned in the second cavity and extends up to a second level relative to the second bottom without a connection disposed in the second cavity. The first and second levels together exceed a height from the first bottom to the second bottom in the closed position. The first and second sealants may be gels.
Public/Granted literature
- US20100124454A1 SEALANT-FILLED ENCLOSURES AND METHODS FOR ENVIRONMENTALLY PROTECTING A CONNECTION Public/Granted day:2010-05-20
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