Invention Grant
- Patent Title: Electronic component package
- Patent Title (中): 电子元件包装
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Application No.: US12222115Application Date: 2008-08-01
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Publication No.: US08178788B2Publication Date: 2012-05-15
- Inventor: Takatoshi Yagisawa , Tadashi Ikeuchi
- Applicant: Takatoshi Yagisawa , Tadashi Ikeuchi
- Applicant Address: JP Kawasaki
- Assignee: Fujitsu Limited
- Current Assignee: Fujitsu Limited
- Current Assignee Address: JP Kawasaki
- Agency: Staas & Halsey LLP
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/11
Abstract:
An electronic component package includes a film board where an electronic component is mounted, and a lid part mounted on the film board so as to cover a surface of the film board. The electronic component is provided in a cavity formed by the film board and the lid part, and the electronic component is connected to a signal wiring conductor formed at the film board.
Public/Granted literature
- US20080289862A1 Electronic component package Public/Granted day:2008-11-27
Information query
