Invention Grant
US08178876B2 Method and configuration for connecting test structures or line arrays for monitoring integrated circuit manufacturing 有权
用于连接用于监控集成电路制造的测试结构或线阵列的方法和配置

  • Patent Title: Method and configuration for connecting test structures or line arrays for monitoring integrated circuit manufacturing
  • Patent Title (中): 用于连接用于监控集成电路制造的测试结构或线阵列的方法和配置
  • Application No.: US10595384
    Application Date: 2004-04-30
  • Publication No.: US08178876B2
    Publication Date: 2012-05-15
  • Inventor: Christopher HessDavid Goldman
  • Applicant: Christopher HessDavid Goldman
  • Applicant Address: US CA San Jose
  • Assignee: PDF Solutions, Inc.
  • Current Assignee: PDF Solutions, Inc.
  • Current Assignee Address: US CA San Jose
  • International Application: PCT/US2004/013483 WO 20040430
  • International Announcement: WO2005/040961 WO 20050506
  • Main IPC: H01L23/58
  • IPC: H01L23/58
Method and configuration for connecting test structures or line arrays for monitoring integrated circuit manufacturing
Abstract:
A test chip comprises at least one level having an array of regions. Each region is capable of including at least one test structure. At least some of the regions include respective test structures. The level has a plurality of driver lines that provide input signals to the test structures. The level has a plurality of receiver lines that receive output signals from the test structures. The level has a plurality of devices for controlling current flow. Each test structure is connected to at least one of the driver lines with a first one of the devices in between. Each test structure is connected to at least one of the receiver lines with a second one of the devices in between, so that each of the test structures can be individually addressed for testing using the driver lines and receiver lines.
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