Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US12573936Application Date: 2009-10-06
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Publication No.: US08178903B2Publication Date: 2012-05-15
- Inventor: Hideyuki Nakamura
- Applicant: Hideyuki Nakamura
- Applicant Address: JP Kanagawa
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Kanagawa
- Agency: Young & Thompson
- Priority: JP2008-259458 20081006
- Main IPC: H01L27/092
- IPC: H01L27/092

Abstract:
A semiconductor device in accordance with an exemplary aspect of the present invention includes: an even number of transistor pairs; connection nodes connecting the n-type transistors and the p-type transistors of the transistor pairs; and inter-gate wiring lines connected to the connection nodes, each inter-gate wiring line connecting a gate of the p-type transistor of one of the transistor pairs disposed in the subsequent stage of one of the transistor pairs for which each connection node is provided, wherein the n-type transistor of a first transistor pair is disposed in a p-well region different from both a p-well region in which the n-type transistor of a second transistor pair disposed in two stages preceding of the first transistor pair is disposed and a p-well region in which the n-type transistor of a third transistor pair disposed in two stages subsequent of the first transistor pair is disposed.
Public/Granted literature
- US20100084689A1 SEMICONDUCTOR DEVICE Public/Granted day:2010-04-08
Information query
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