Invention Grant
US08178944B2 Method for forming a one-time programmable metal fuse and related structure
有权
形成一次性可编程金属保险丝及相关结构的方法
- Patent Title: Method for forming a one-time programmable metal fuse and related structure
- Patent Title (中): 形成一次性可编程金属保险丝及相关结构的方法
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Application No.: US12456833Application Date: 2009-06-22
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Publication No.: US08178944B2Publication Date: 2012-05-15
- Inventor: Wei Xia , Xiangdong Chen , Akira Ito
- Applicant: Wei Xia , Xiangdong Chen , Akira Ito
- Applicant Address: US CA Irvine
- Assignee: Broadcom Corporation
- Current Assignee: Broadcom Corporation
- Current Assignee Address: US CA Irvine
- Agency: Farjami & Farjami LLP
- Main IPC: H01L29/00
- IPC: H01L29/00

Abstract:
According to one exemplary embodiment, a method for forming a one-time programmable metal fuse structure includes forming a metal fuse structure over a substrate, the metal fuse structure including a gate metal segment situated between a dielectric segment and a polysilicon segment, a gate metal fuse being formed in a portion of the gate metal segment. The method further includes doping the polysilicon segment so as to form first and second doped polysilicon portions separated by an undoped polysilicon portion where, in one embodiment, the gate metal fuse is substantially co-extensive with the undoped polysilicon portion. The method can further include forming a first silicide segment on the first doped polysilicon portion and a second silicide segment on the second doped polysilicon portion, where the first and second silicide segments form respective terminals of the one-time programmable metal fuse structure.
Public/Granted literature
- US20100320561A1 Method for forming a one-time programmable metal fuse and related structure Public/Granted day:2010-12-23
Information query
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