Invention Grant
- Patent Title: Microstrip structure including a signal line with a plurality of slit holes
- Patent Title (中): 微带结构包括具有多个狭缝孔的信号线
-
Application No.: US12356589Application Date: 2009-01-21
-
Publication No.: US08178974B2Publication Date: 2012-05-15
- Inventor: Masayuki Mizuno
- Applicant: Masayuki Mizuno
- Applicant Address: JP Tokyo
- Assignee: NEC Corporation
- Current Assignee: NEC Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP11-266203 19990920
- Main IPC: H01L23/58
- IPC: H01L23/58
Abstract:
A semiconductor device comprising a signal transmission line of a microstrip structure, capable of increasing the characteristic impedance of the signal transmission line and reducing coupling between a plurality of signal lines. In a signal transmission line of a microstrip structure composed of a signal line and a ground plate, the capacitance between wires is reduced and the characteristic impedance can be increased by forming holes in the signal line or in the ground plate. The coupling between a plurality of signal lines can also be reduced.
Public/Granted literature
- US20090134524A1 SEMICONDUCTOR INTEGRATED CIRCUIT Public/Granted day:2009-05-28
Information query
IPC分类:
