Invention Grant
- Patent Title: Antennas using chip-package interconnections for millimeter-wave wireless communication
- Patent Title (中): 天线采用毫米波无线通信的芯片封装互连
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Application No.: US12437809Application Date: 2009-05-08
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Publication No.: US08179333B2Publication Date: 2012-05-15
- Inventor: Fnu Rajanish , Nitin Jain , Gaurav Menon , Angelos Alexanian
- Applicant: Fnu Rajanish , Nitin Jain , Gaurav Menon , Angelos Alexanian
- Applicant Address: US CA San Diego
- Assignee: Anokiwave, Inc.
- Current Assignee: Anokiwave, Inc.
- Current Assignee Address: US CA San Diego
- Main IPC: H01Q9/28
- IPC: H01Q9/28
Abstract:
A compact millimeter-wave transmitter and receiver make use of interconnections within a chip-containing package for providing an integrated antenna. Due to shorter wavelength of millimeter-waves, these interconnections can be used as antennas for radiation of electromagnetic waves. A dielectric cover or lens is provided within the package to increase the antenna's directivity and to provide a mechanical shield for the chip.
Public/Granted literature
- US20100283700A1 Antennas Using Chip-Package Interconnections for Millimeter-wave Wireless Communication Public/Granted day:2010-11-11
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