Invention Grant
- Patent Title: Method and apparatus for controlling removal of a circuit board module from a chassis
- Patent Title (中): 控制电路板模块从底盘移除的方法和装置
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Application No.: US12070768Application Date: 2008-02-21
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Publication No.: US08179680B1Publication Date: 2012-05-15
- Inventor: Mandy Lam , Jimmy C. Leung , Toan Nguyen , Saeed Seyed
- Applicant: Mandy Lam , Jimmy C. Leung , Toan Nguyen , Saeed Seyed
- Applicant Address: US CA San Jose
- Assignee: Cisco Technology, Inc.
- Current Assignee: Cisco Technology, Inc.
- Current Assignee Address: US CA San Jose
- Main IPC: H05K7/16
- IPC: H05K7/16
Abstract:
A method and apparatus for controlling removal of a circuit board module from a chassis comprising an actuator and an electrical switch. The actuator having a locked state and an unlocked state, where the circuit board module is removable from the chassis when the actuator is in the unlocked state and the circuit board module is not removable when the actuator is in the locked state. The electrical switch is coupled to the actuator to produce a first signal indicating the locked state and a second signal indicating the unlocked state.
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