A printed circuit board has capacitors, a grounding wiring pattern having a bonding surface on which a semiconductor device is bonded, and a contact surface located opposite from the bonding surface thereof and coupled to first electrodes of the capacitors, and a power supply wiring pattern having a bonding surface on which the semiconductor device is bonded, and a contact surface located opposite from the bonding surface thereof and coupled to second electrodes of the capacitors. The grounding and power supply wiring patterns are alternately arranged in a predetermined direction, and the capacitors are coupled in parallel with respect to the grounding and power supply wiring patterns.