A headset device that includes an earbud housing, a primary housing, a threaded neck, an earbud screw, and a primary housing screw is provided. The earbud housing can include an earbud through-hole and a first neck engaging surface. The primary housing can include a housing through-hole and a second neck engaging surface. The threaded neck can include first and second neck surfaces that can mate, respectively to the first and second neck engaging surface. The earbud screw can fit through the earbud through-hole and can interlock with the threaded neck to fix the earbud housing to the threaded neck. The primary housing screw can fit through the housing through-hole and can interlock with the threaded neck to fix the primary housing to the threaded neck. The threaded neck can include a through-hole for enabling circuitry disposed in the earbud housing to electrically couple to circuitry disposed in the primary housing.