Invention Grant
- Patent Title: Conductive paste and mounting structure using the same
- Patent Title (中): 导电胶和使用其的安装结构
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Application No.: US12427275Application Date: 2009-04-21
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Publication No.: US08182923B2Publication Date: 2012-05-22
- Inventor: Naomichi Ohashi , Hidenori Miyakawa , Atsushi Yamaguchi , Arata Kishi , Takayuki Higuchi
- Applicant: Naomichi Ohashi , Hidenori Miyakawa , Atsushi Yamaguchi , Arata Kishi , Takayuki Higuchi
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2008-112197 20080423
- Main IPC: H01B1/22
- IPC: H01B1/22 ; B32B15/08

Abstract:
A conductive paste includes a filler component and a flux component; the filler component including a first conductive filler and a second conductive filler having different melting points, and the melting point of the first conductive filler being higher than the melting point of the second conductive filler by 20° C. or more; the flux component including a first flux and a second flux having different melting points, the melting point of the first flux being higher than the melting point of the second flux, and the melting point of the first flux being higher than the melting point of the second conductive filler by 15° C. to 45° C.; and the melting point of the second flux being equal to or less than the melting point of the second conductive filler.
Public/Granted literature
- US20090269598A1 CONDUCTIVE PASTE AND MOUNTING STRUCTURE USING THE SAME Public/Granted day:2009-10-29
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