A method of manufacturing a multilayer printed circuit board, including providing a substrate, embedding an electronic component having a die pad on a surface of the component into the substrate such that the component has the surface and pad exposed from a surface of the substrate, forming a metallic layer including metallic film layers such that the surface of the substrate and the pad and surface of the component are covered with the metallic layer, providing a resist on the metallic layer such that a portion of the metallic layer on the pad is exposed from the resist, forming a thickening metallic layer on the portion of the metallic layer exposed, removing the resist from the substrate and surface of the component, and etching to remove the metallic layer such that a mediate layer including the portion of the metallic layer is formed between the pad and the thickening layer.