Invention Grant
- Patent Title: Ultra thin alignment walls for di-block copolymer
- Patent Title (中): 用于二嵌段共聚物的超薄对准壁
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Application No.: US12270511Application Date: 2008-11-13
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Publication No.: US08187480B2Publication Date: 2012-05-29
- Inventor: Kim Yang Lee , David S. Kuo , Dorothea Buechel , Kalman Pelhos
- Applicant: Kim Yang Lee , David S. Kuo , Dorothea Buechel , Kalman Pelhos
- Applicant Address: US CA Cupertino
- Assignee: Seagate Technology, LLC
- Current Assignee: Seagate Technology, LLC
- Current Assignee Address: US CA Cupertino
- Agency: Ladas & Parry, LLP
- Main IPC: B44C1/22
- IPC: B44C1/22
Abstract:
Methods comprising providing a pre-patterned substrate having an array of thick walls, depositing a conforming layer on the pre-patterned substrate, etching the conforming layer from the top of the thick walls and the space between the walls, and etching the thick walls while leaving thin walls of conforming layer.
Public/Granted literature
- US20100119778A1 ULTRA THIN ALIGNMENT WALLS FOR DI-BLOCK COPOLYMER Public/Granted day:2010-05-13
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