Invention Grant
- Patent Title: Circuit materials, circuits laminates, and method of manufacture thereof
- Patent Title (中): 电路材料，电路层压体及其制造方法
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Application No.: US12504996Application Date: 2009-07-17
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Publication No.: US08187696B2Publication Date: 2012-05-29
- Inventor: Sankar K. Paul , Christopher J. Caisse , Dirk M. Baars , Allen F. Horn, III
- Applicant: Sankar K. Paul , Christopher J. Caisse , Dirk M. Baars , Allen F. Horn, III
- Applicant Address: US IL Lincolnwood
- Assignee: World Properties, Inc.
- Current Assignee: World Properties, Inc.
- Current Assignee Address: US IL Lincolnwood
- Agency: Cantor Colburn LLP
- Main IPC: B32B15/00
- IPC: B32B15/00
Abstract:
A circuit substrate laminate, comprising a conductive metal layer; and a dielectric composite material having a dielectric constant of less than about 3.5 and a dissipation factor of less than about 0.006, wherein the dielectric composite material comprises: a polymer resin; and about 10 to about 70 volume percent of cenospheres having a ferric oxide content of less than or equal to 3 weight percent.
Public/Granted literature
- US20100015404A1 CIRCUIT MATERIALS, CIRCUITS LAMINATES, AND METHOD OF MANUFACTURE THEREOF Public/Granted day:2010-01-21
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