Invention Grant
- Patent Title: Multilayer electronic component and electronic component module including the same
- Patent Title (中): 多层电子元器件和电子元器件模块包括
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Application No.: US12486477Application Date: 2009-06-17
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Publication No.: US08188828B2Publication Date: 2012-05-29
- Inventor: Takashi Noma , Jun Sasaki , Kosuke Yamada
- Applicant: Takashi Noma , Jun Sasaki , Kosuke Yamada
- Applicant Address: JP
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP
- Agency: Studebaker & Brackett PC
- Agent Tim L. Brackett, Jr.; John F. Guay
- Priority: JP2007-335086 20071226
- Main IPC: H01F5/00
- IPC: H01F5/00 ; H01F27/30 ; H01F27/28

Abstract:
A multilayer electronic component that can suppress the formation of projections and depressions on a surface, and an electronic component unit including the multilayer electronic component, are provided. In the multilayer electronic component, coil electrodes (8) having a shape of ring-shaped wiring with a part removed therefrom are electrically connected to each other to constitute a coil (L). Magnetic layers (4) are stacked together with the plurality of coil electrodes (8). The coil electrodes (8a, 8c, 8e) having a radius r1 and the coil electrodes (8b, 8d) having a radius r2 that is smaller than the radius r1 may be alternately arranged in a stacking direction.
Public/Granted literature
- US20090256668A1 MULTILAYER ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT MODULE INCLUDING THE SAME Public/Granted day:2009-10-15
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