Invention Grant
- Patent Title: Heat transport assembly
- Patent Title (中): 热运输组装
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Application No.: US12524613Application Date: 2008-01-29
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Publication No.: US08189335B2Publication Date: 2012-05-29
- Inventor: Robert H. C. Janssen , Jacob Koenen , Franciscus Van Vehmendahl
- Applicant: Robert H. C. Janssen , Jacob Koenen , Franciscus Van Vehmendahl
- Applicant Address: NL Heerlen
- Assignee: DSM IP Assets B.V.
- Current Assignee: DSM IP Assets B.V.
- Current Assignee Address: NL Heerlen
- Agency: Nixon & Vanderhye P.C.
- Priority: EP07002361 20070202
- International Application: PCT/EP2008/000674 WO 20080129
- International Announcement: WO2008/092635 WO 20080807
- Main IPC: H05K7/20
- IPC: H05K7/20
Abstract:
Heat transport assemblies are provided with a first part plastic part and a second part. The heat transport assemblies have a first surface area on the first part in heat conductive contact with a second surface area on the second part, wherein the first surface area and the second surface area consist of a surface material having a heat conductivity of at least 50 W/m·K.
Public/Granted literature
- US20100118495A1 HEAT TRANSPORT ASSEMBLY Public/Granted day:2010-05-13
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