Invention Grant
US08189424B2 Semiconductor memory device having plurality of types of memories integrated on one chip
有权
具有集成在一个芯片上的多种类型的存储器的半导体存储器件
- Patent Title: Semiconductor memory device having plurality of types of memories integrated on one chip
- Patent Title (中): 具有集成在一个芯片上的多种类型的存储器的半导体存储器件
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Application No.: US12397711Application Date: 2009-03-04
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Publication No.: US08189424B2Publication Date: 2012-05-29
- Inventor: Kazuto Uehara , Toshifumi Watanabe , Shigefumi Ishiguro , Kazuyoshi Muraoka
- Applicant: Kazuto Uehara , Toshifumi Watanabe , Shigefumi Ishiguro , Kazuyoshi Muraoka
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2008-165012 20080624
- Main IPC: G11C8/00
- IPC: G11C8/00

Abstract:
A semiconductor memory device configured to perform a clock synchronous burst read operation includes a plurality of buffer memories having different bank structures, and first and second data latch circuits storing read data read from the plurality of buffer memories. The semiconductor memory device further includes a control circuit that controls a timing of starting counting up addresses and a timing of storing read data in the first data latch circuit at the time of the clock synchronous burst read operation in accordance with the bank structure of the buffer memory as a read operation target.
Public/Granted literature
- US20090316494A1 SEMICONDUCTOR MEMORY DEVICE HAVING PLURALITY OF TYPES OF MEMORIES INTEGRATED ON ONE CHIP Public/Granted day:2009-12-24
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