Invention Grant
US08190086B2 Transmission method, interface circuit, semiconductor device, semiconductor package, semiconductor module and memory module
失效
传输方法，接口电路，半导体器件，半导体封装，半导体模块和存储器模块
- Patent Title: Transmission method, interface circuit, semiconductor device, semiconductor package, semiconductor module and memory module
- Patent Title (中): 传输方法，接口电路，半导体器件，半导体封装，半导体模块和存储器模块
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Application No.: US12065068Application Date: 2006-08-04
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Publication No.: US08190086B2Publication Date: 2012-05-29
- Inventor: Hideki Sasaki , Muneo Fukaishi , Toru Taura
- Applicant: Hideki Sasaki , Muneo Fukaishi , Toru Taura
- Applicant Address: JP Tokyo
- Assignee: NEC Corporation
- Current Assignee: NEC Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2005-255576 20050902
- International Application: PCT/JP2006/315509 WO 20060804
- International Announcement: WO2007/029435 WO 20070315
- Main IPC: H04B5/00
- IPC: H04B5/00
Abstract:
An interface circuit, which uses electromagnetic induction to perform a signal transmission, comprises a transmission coil and a transmission circuit that provides a signal to the transmission coil, thereby causing the transmission coil to output a triangular or roughly triangular magnetic field signal.
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